HP EX900 M.2 250GB PCIe 3.0 x4 NVMe

Details

Form Factor

M.2 2280

Capacity

250GB

Memory Components

3D TLC

Interface

PCI-Express 3.0 x4, NVMe 1.3

Controller

HP

Performance

Max Sequential Read

Up to 2100 MBps

Max Sequential Write

Up to 1500 MBps

4KB Random Read

Up to 120,000 IOPS

4KB Random Write

Up to 108,000 IOPS

Read Latency

0.021 ms

Write Latency

0.029 ms

MTBF

2,000,000 hours

Features

Features

High performance Low power Increased system responsiveness High reliability Small form-factor Minimum weight Enhanced ruggedness High data Integrity and Security

Environmental

Power Consumption (Idle)

0.68W

Power Consumption (Active)

3.52W

Operating Temperature

0°C ~ +70°C

Storage Temperature

-40°C ~ +85°C

Operating Humidity

5-95%

Max Shock Resistance

100G / 6 msec

Max Vibration Resistance

3.1 GRMS (2-500 Hz)